The mechanical properties of NiTi shape memory alloy (SMA) components are sensitive to thermal influence during laser machining. To make the femtosecond laser cutting of NiTi material meet the strict fabrication requirements for miniature SMA devices with high precision, complex patterns and minimal heat affected zone (HAZ) along with high throughput, we report an optimal process of sideways-movement path planning in this article. Femtosecond laser processing of NiTi SMA using the fundamental wavelength of 775 nm from a Ti:sapphire laser along with its second and third harmonic irradiations were systematically investigated. We observed that the main impact of ultrashort laser pulse induced air breakdown on materials processing was beam widening. The laser beam at fundamental wavelength suffered less widening than its harmonic wavelengths. Femtosecond laser machining of metals is still basically a thermal mechanism. High ablation rates at higher laser fluences causes significant recast formation, while lower fluences resulted in better cutting quality at the expense of efficiency. The optimal process involving the method of sideways-movement path planning enables recast-free high-precision features at higher laser fluences with better throughput.
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